The U.S. has implemented a series of export controls since October 2022 to restrict China’s access to advanced semiconductor technologies, imposing limitations on tech giants like Intel, Qualcomm, and NVIDIA from shipping cutting-edge chips to China. Now, reports indicate that the White House is considering additional restrictions on China’s access to gate-all-around (GAA) transistor technology and high-bandwidth memory (HBM). The Big Three semiconductor companies, TSMC, Intel, and Samsung, have each announced their plans to incorporate GAA technology in their upcoming processes, signaling a shift in semiconductor innovation.
GAA transistors, essential for advancing Moore’s Law, replace the vertical fin structure in FinFET transistors with horizontal sheets to reduce leakage and enhance drive current, ultimately improving chip performance. The U.S. and its allies are expected to implement controls on GAAFET structures used in advanced node chips, potentially impacting China’s ability to develop GAA chips or acquire them from international chipmakers. Additionally, discussions have arisen about restricting exports of HBM chips produced by memory giants like SK Hynix and Samsung, which are crucial for enhancing AI applications and boosting performance in companies like NVIDIA. These developments highlight the complex landscape of global semiconductor trade and the evolving dynamics between major players in the industry.
